Description: 3% Silver (SAC305) formulaNo Clean Flux (Residues are Non-corrosive, Non-conductive)Easily DispensedExcellent WettabilityIdeal for surface mount applications MG Chemicals has developed a unique flux system designed specifically for high temperature Unleaded alloys. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, MG 4900P Unleaded Solder paste will provide excellent cost savings. In addition, MG 4900P Unleaded solder paste exhibits superior joint strength, excellent wettability, and extraordinary print definition and tack life. The post soldering residues of MG 4900P are non-conductive, non-corrosive and highly insulated.
Price: 46.05 USD
Location: Clarksville, Tennessee
End Time: 2024-08-30T14:10:43.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
Restocking Fee: No
Return shipping will be paid by: Seller
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Brand: Does not apply
MPN: Does not apply
Item model number: 4900P-25G
Unit Count: 1 Each
Item Volume: 25 Milliliters
Product Dimensions: 1.97 x 0.79 x 7.87 inches; 0.88 ounces
Country of Origin: USA
Sterility Rating: SAC305
Size: 0.9 oz
Type: Does not apply
